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Three-dimensional integrated circuit
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21	:22 Uhr Seite 1 Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 04:32:11 Fraunhofer Society Laboratories Integrated circuit Electromagnetic compatibility Electromagnetic interference Printed circuit board Radio-frequency identification Three-dimensional integrated circuit RF MEMS Technology Electromagnetism Electronics
22	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 03:08:02 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
23	Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING cpmt.ieee.org Add to Reading List Source URL: cpmt.ieee.org Language: English - Date: 2013-01-14 11:33:21 Technology Electronics International nongovernmental organizations Professional associations Standards organizations Three-dimensional integrated circuit Institute of Electrical and Electronics Engineers Through-silicon via Prognostics Integrated circuits Semiconductor device fabrication Electronic engineering
24	Advanced Technology Option Micro-via Technology Within the powerful Pulsonix environment, advanced Micro-via technologies are easily created for everyday design engineers. Constraint Rules Driven Add to Reading List Source URL: www.pulsonix.com Language: English - Date: 2013-08-20 05:26:18 Electromagnetism Electronic design Via Printed circuit board PCB Surface-mount technology Design rule checking Three-dimensional integrated circuit Quad-flat no-leads package Electronic engineering Electronics manufacturing Electronics
25	Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING www.cpmt.org Add to Reading List Source URL: cpmt.ieee.org Language: English - Date: 2011-11-16 12:27:21 Electronic engineering Three-dimensional integrated circuit Technology IEEE Components Packaging & Manufacturing Technology Society International nongovernmental organizations Institute of Electrical and Electronics Engineers Engineering
26	F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Electronic Packaging & System Integration Invisible – Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 05:52:04 Technology Wafer bonding Integrated circuit packaging Reliability Flip chip Wafer Etching EV Group Three-dimensional integrated circuit Semiconductor device fabrication Microtechnology Electronics
27	Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING cpmt.ieee.org Add to Reading List Source URL: cpmt.ieee.org Language: English - Date: 2012-08-29 14:57:52 Engineering Institute of Electrical and Electronics Engineers Electronic engineering Three-dimensional integrated circuit Technology IEEE Components Packaging & Manufacturing Technology Society International nongovernmental organizations Professional associations Standards organizations
28	F R A U N H O F E R I N S T I T U T E F O R R e l ia b i l it y an d M i c roin T e g ration I Z M Department System Integration and Interconnection Technologies Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-25 21:27:51 Semiconductor device fabrication Integrated circuits Semiconductor devices Electrical engineering Integrated circuit packaging Three-dimensional integrated circuit Integrated circuit System in package Microelectromechanical systems Technology Electromagnetism Electronics
29	Quantifying the Relationship between the Power Delivery Network and Architectural Policies in a 3D-Stacked Memory Device Manjunath Shevgoor Jung-Sik Kim Add to Reading List Source URL: www.cs.utah.edu Language: English - Date: 2013-11-01 14:03:29 Computing Dynamic random-access memory DDR3 SDRAM Memory controller Power network design Three-dimensional integrated circuit DIMM Random-access memory DDR4 SDRAM Computer memory Computer hardware Digital media
30	AMS Working Group August 22, 2012 Agenda Time Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:55 Three-dimensional integrated circuit Electronics Electronic engineering Integrated circuits Cadence Design Systems